Product Change Notifications
The table below lists product change notifications (PCNs) for FTDI devices.
To view a product change notification, click on the document title.
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| PCN Number | Part Number(s) Affected | Change Description | Estimated Implementation Date |
| PCN 00001 | FT232RQ FT232RL FT245RQ FT245RL |
Metal layer change to the wafer mask set | 30-01-2008 |
| PCN 00002 | FT2232C FT2232L |
Replaced by FT2232D | 28-03-2008 |
| PCN_FT_005 | FT2232HQ FT2232HL FT4232HQ FT4232HL |
Silicon modifications have resulted in the device being modified to Revision C | 15-04-2010 |
| PCN_FT_006 | VNC2-32Q1x VNC2-32L1x VNC2-48Q1x VNC2-48L1x VNC2-64Q1x VNC2-64L1x |
Silicon modifications have resulted in the device being updated to Revision B | 29-07-2010 |
| PCN_FT_007 | FT2232HQ_Mini_Module FT4232HQ_Mini_Module |
Modules have been redesigned to use the LQFP package, replacing the QFN package. | 01-2011 |
| PCN_FT_008 | FT232RQ FT232RL FT245RQ FT245RL |
The present Rev-B of this device will be replaced by Rev-C of the device. | 04-2011 |
| PCN_FT_009 | VNCL0-MB1A VNCLO-PSU-US VNCLO-PSU-EU VNCLO-PSU-UK VNCLO-SHLD1A VNCLO-START1 |
The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco | 04-2011 |
| PCN_FT_011 | FT200XD FT201XS FT201XQ FT220XS FT220XQ FT221XS FT221XQ FT230XS FT230XQ FT231XS FT231XQ FT240XS FT240XQ |
FT-X series of devices revised from Revision B to Revision C | 11-06-2012 |
| PCN_FT_012 | FT200XD FT201XS FT201XQ FT220XS FT220XQ FT221XS FT221XQ FT230XS FT230XQ FT231XS FT231XQ FT240XS FT240XQ |
FT-X series of devices revised from Revision C to Revision D | 31-10-2012 |
| PCN_FT_013 | VPROG-1-S-LQFP48 | VPROG 48 pin socket revised from rev 1 to rev 2 | 13-11-2012 |
| PCN_FT_014 | FT311D | Update to enable Android Open Accessory Mode 2.0 | 11-12-2012 |
| PCN_FT_015 | FT232HL FT232HQ |
Update to support VREGIN at 3.3V | 17-04-2013 |
| PCN_FT_016 | FT120Q FT120Q |
Update to improve compatibility with D12 | 05-07-2013 |
| PCN_FT_020 | FT4222H | Upgrade to improve I2C performance and ease of use | 14-09-2015 |
| PCN_FT_022 | VNC2-32Q1C VNC2-32L1C VNC2-48L1C VNC2-64L1C |
Update to add VNC2-32L1C,VNC2-48L1C, and VNC2-64L1C to the list | 07-2016 |
| PCN_FT_023 | FT600Q FT601Q |
Update from Rev A to Rev B to fix some functional issues | 10-2016 |
| PCN_FT_025 | UMFT600A UMFT601A UMFT600X UMFT601X |
Update FT60x to Rev B in UMFT60xx modules | 10-2016 |
| PCN_FT_026 | UMFT4222EV UMFT4222EV-B UMFT4222EV-C |
Update FT4222HQ to Rev D in UMFT4222EV modules | 04-2018 |
| PCN_FT_027 | VNC2-48Q1B, VNC2-64Q1B | Update from Revision B to Revision C | 04-2017 |
| PCN_FT_028 | FT4222 HQ Hi-Speed Quad SPI / I2C device |
Update from Rev. C to Rev. D, to improve speed and minor bug fixes |
04-2018 |
| PCN_FT_029 | FT4222 Programmer Module | Resolved Power Switch control issues | 05-2017 |
| PCN_FT_035 | FT602, UMFT602A, UMFT602X | Updated FT602 Chips to Rev. B and Chips on Development Modules | 01-2018 |
| PCN_FT_036 | FT4222HQ Hi-Speed Quad SPI/I2C device | Lead Frame Change | 01-2019 |
| PCN_FT_038 | FT232HQ FT232HL |
1. Lead Frame 2. Packing Material |
01-2024 |
| PCN_FT_039 | FT232RL FT232RQ |
1. Lead Frame 2. Packing Material for FT232RL (Reel) |
03-2019 |
| PCN_FT_040 | FT245RL FT245RQ |
1. Lead Frame 2. Packing Material for FT245RL (Reel) |
06-2019 |
| PCN_FT_041 | FT311D-32Q1C FT311D-32L1C |
1. Lead Frame 2. Packing Material |
06-2019 |
| PCN_FT_042 | FT312D-32Q1C FT312D-32L1C |
1. Lead Frame 2. Packing Material |
05-2019 |
| PCN_FT_045 | FT2232HQ FT2232H-56Q FT2232HL |
1. Lead Frame 2. Packing Material |
01-2024 |
| PCN_FT_046 | FT4232HQ FT4232H-56Q FT4232HL |
1. Lead Frame 2. Packing Material |
01-2024 |
| PCN_FT_047 | VNC2-32Q1C VNC2-321L1C VNC2-48Q1C VNC2-48L1C |
1. Lead Frame 2. Packing Material |
06-2019 |
| PCN_FT_048 | FT120T | 1. Lead Frame 2. Packing Material |
01-2020 |
| PCN_FT_051 | FT232BQ FT232BL FT245BL FT2232D FT260 |
1. Lead Frame 2. Packing Material |
12-2020 |
| PCN_FT_052 | FT200XD FT201X FT220XS FT221XQ FT230X FT231X FT240X FT234XD |
1. Lead Frame 2. Packing Material |
12-2020 |
